Online test method of FPGA solder joint resistance with low power consumption
نویسندگان
چکیده
منابع مشابه
Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers
Micron sizes solder metallurgical joints have been applied in a thin film application of anisotropic conductive film and benefited three general advantages, such as lower joint resistance, higher power handling capability, and reliability, when compared with pressure based contact of metal conductor balls. Recently, flex-on-board interconnection has become more and more popular for mobile elect...
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عنوان ژورنال:
- Microelectronics Reliability
دوره 55 شماره
صفحات -
تاریخ انتشار 2015